 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| Excellence in Electronics Attention Points In Handling SLA580 Serise Through-hole LEDs Visual light emitting diodes does not contain reinforcement materials such as glass fillers. Therefore if sudden thermal and mechanical shock are given, destruction or inferiority of luminous intensity may occur. Please take care of the handling. FIXATION METHOD 1.ATTENTION POINTS 1-1) Please do not give excessive heat over storage temperature to resin. However, In case that the product has to be heated in oven for the glue fixing, it can stand under (125MAX, 120secMAX) condition. 1-2) Please avoid stress to resin at high temperature. 2.TERMINATION PROCESSING 2-1) In case of termination processing, please fix the termination processing position, and process before reverse side of LED body. Please process before soldering. If stress is given during processing, It may cause non-lighting failure. To be fixed 3.ASSEMBLY ON PC BOARD 3-1) In case of soldering on PCB, if the operation is done with stress, it may cause non-lighting failure during soldering or using. x 3-2) Therefore please design holes of PCB suitable for termination space or termination space after forming, and avoid the stress. Especially in case of clinch to PCB, please do not leave remained stress. Enough evaluation is requested before deciding assembly conditions. Please consult with us if any problems emerged in the evaluation stage. MIN 15 MIN 45 Anode (GaAlAs chip : Cathode) REV. : A ROHM CO., LTD. PAGE:1/2 Excellence in Electronics Attention Points In Handling SLA580 Serise Through-hole LEDs 4.SOLDERINGSn-3Ag-0.5Cu 4-1) Please make soldering rapidly under the following temperature and time conditions. 4-2) Please avoid stress to LED lamp during soldering. 4-3) Recommendable soldering conditions are as follows : ARTIICLE Soldering Dip Preheat Soldering Bath SOLDERING TEMP Max. 100 Max. 265 Max. 400 OPERATION TIME Max. 60sec Max. 5sec Max. 3sec Soldering Iron 5.CLEANING 5-1) In case of cleaning, some solvents may cause damage of resin or cause non-lighting failure, so please check the solvent before actual use. The recommendable cleaning solvent is alcoholic one such as isopropyl alcohol. RECOMMENDABLE CLEANING CONDITIONS METHOD Cleaning by solvent Cleaning by ultrasonic CONDITIONS Temperature of solvent : Max. 45 Immersion time : Max. 3min Ultrasonic out : Max. 15W/Liter Cleaning time : Max. 3min ATTENTION ON STORAGING Storage in dry box is most desirable, but if it is not possible, we recommend following conditions. Temperature : 5 30 Humidity : Max. 60% RECOMMENDABLE ROUND PATTERN Round pattern depends on the material PCB, density and circuit arrangement. Our recommendation is as follow : 2.0 1.0 0.1 Unit : mm Lead types : 0.5mm 2.5 5.0 REV. : B ROHM CO., LTD. PAGE:2/2 |
Price & Availability of SLA580
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |